Semiconductor package and method of forming same

• Main Authors: LIN BAIYAO, LAI BAICHEN, XU JIAGUI, YOU MINGZHI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure provide a semiconductor package and a method of forming the same. The semiconductor package includes a package substrate, a semiconductor device, an underfill element, and a recess. The semiconductor device is bonded to a surface of the package substrate through a plurality of electrical connectors. An underfill element is formed between the semiconductor device and the surface of the package substrate to surround and protect the electrical connectors. The underfill element includes a ribbon extending laterally beyond and formed along a periphery of the semiconductor device. A recess is formed in the strip portion and spaced apart from a periphery of the semiconductor device. 本公开实施例提供一种半导体封装及其形成方法。所述半导体封装包括封装基板、半导体装置、底部填充元件以及凹槽。半导体装置通过多个电连接件接合到封装基板的表面。底部填充元件形成在半导体装置与封装基板的表面之间，以围绕并保护所述电连接件。底部填充元件包括横向延伸超出半导体装置的外围并沿着半导体装置的外围形成的带状部。凹槽形成在带状部中并与半导体装置的外围间隔开。