Donor substrate, transfer apparatus, and donor substrate preparation method

The invention discloses a donor substrate, transfer equipment and a donor substrate preparation method, the donor substrate is used for transferring a transfer material to a receiving substrate, the donor substrate comprises a base layer, an absorption layer and a transfer layer which are sequential...

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Bibliographic Details
Main Authors HUANG BAIYUAN, PENG XINHAN, CHEN QIUXING, WEN XI, WANG GUOAN
Format Patent
LanguageChinese
English
Published 16.09.2022
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Summary:The invention discloses a donor substrate, transfer equipment and a donor substrate preparation method, the donor substrate is used for transferring a transfer material to a receiving substrate, the donor substrate comprises a base layer, an absorption layer and a transfer layer which are sequentially stacked in the thickness direction, the base layer can allow laser to penetrate through, the absorption layer can absorb the laser to drive the transfer layer to be separated, the donor substrate further comprises a protection layer which covers the surface, away from the absorption layer, of the transfer layer, and the melting point of the protection layer is higher than that of the transfer layer. The transfer layer is covered with the protective layer, oxidation of the transfer layer in the heating process can be reduced or avoided, the connection strength between the transfer layer and the receiving substrate is guaranteed, and then the welding quality of the LED is guaranteed. 本发明公开了一种供体基板、转移设备与供体基板制备方法,供体基
Bibliography:Application Number: CN202210599908