Conductive guide hole and manufacturing method thereof

• Main Authors: LONG DANIEL, OWENS ADAM, NOLETTE ALLEN D, MCGRAW NICOLE, LIOTTA, ANDREW, HAYNES, HAMANN THOMAS JACOB, MOEN, LAURENT, SAVINE, BETZ HEIDI, HARDIKAR VISHWAS VINAYAK, HOLLAND TROY BENTON, KUMAR AJIT, GOYA DANIEL
• Format: Patent
• Language: Chinese; English
• Published: 13.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The electrical component is provided by a plated-through hole extending through the glass substrate. The electrical component may be manufactured by forcing a suspension of conductive particles suspended in a liquid medium through the aperture. The suspension may be forced into the bore under pressure differences, centrifugal forces, or electrostatic forces, etc. The liquid medium in the pores may be dried, and the particles may be sintered. The particles may be further encapsulated in the pores. Alternatively or additionally, the particles may be pressed against the outer surface of the substrate to create a raised structure. 电部件由延伸穿过玻璃基板的金属化孔提供。所述电部件可以通过迫使悬浮在液体介质中的导电颗粒的悬浮液通过所述孔制造。悬浮液可在气压差、离心力或静电力等气压差下被迫进入孔内。所述孔中的液体介质可以被干燥，并且所述颗粒可以被烧结。所述颗粒可进一步封装在所述孔中。可选地或另外地，颗粒可以被压在基板的外表面上以产生隆起结构。