Electrostatic edge ring placement system for substrate processing

• Main Authors: MACHUSHKIN, ALEXANDER, MARAKHTANOV ALEXEI, MAYES, ADAM, CHRISTOPHER, KOZAKEVICH, FELIX, LEIB, COMENDANT, KEITH, HOLLAND JOHANN, EHRLICH DARRELL
• Format: Patent
• Language: Chinese; English
• Published: 13.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

An edge ring system includes a substrate support configured to support a substrate during plasma processing, and includes a substrate and an upper layer disposed on the substrate. An edge ring support includes a first body and an electrostatic clamping electrode disposed in the first body. The edge ring support is disposed over the substrate and radially outward of the substrate during processing. The edge ring includes a second body disposed on the edge ring support and electrostatically clamped to the edge ring support during plasma processing. 一种边缘环系统包含被配置为在等离子体处理期间支撑衬底的衬底支撑件，并且包含基板和被布置在所述基板上的上层。边缘环支撑件包含第一主体和被布置在所述第一主体中的静电夹持电极。在处理期间所述边缘环支撑件被布置在所述基板上方并且在所述衬底的径向外侧。边缘环包含第二主体，所述第二主体在等离子体处理期间布置在所述边缘环支撑件上并且被静电夹持至所述边缘环支撑件。