Chip sintering mold structure and chip fixing method

• Main Authors: JIAO ANYUAN, YE XIAOFEI, YIN YUZE, XI YALI, HUANG DONG, LYU XIAOYUN, YAO JINSHI
• Format: Patent
• Language: Chinese; English
• Published: 06.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of hybrid integrated circuit surface-mounted device assembly, is suitable for a hybrid integrated circuit power chip sintering process, and discloses a chip sintering mold structure and a chip fixing method. A plurality of chips can be fixed and sintered in the chip sintering mold at the same time, the working efficiency is improved, the chip assembly comprises a molybdenum sheet and a chip which are arranged in the chip sintering mold, and welding flux is arranged between the molybdenum sheet and the chip; and the fixing effect of the chip is increased. The chip sintering mold is simple in structure, replaces a traditional method that a clamp is adopted for fixing, solves the problems of chip damage and low production efficiency during chip surface sintering, and improves the production efficiency and the yield of chip sintering. 本发明涉及混合集成电路表贴器件组装技术领域，适用于混合集成电路功率芯片烧结工艺，公开了一种芯片烧结模具结构及芯片固定方法，在芯片烧结模具板上设置若干芯片烧结模具，可同时实现若干个芯片在芯片烧结模具内的固定烧结工作，提高了工作效率，芯片组件包括在芯片烧结模具内的钼片和芯片，