Electromagnetic wave shielding film

• Main Authors: UMEMURA SHIGEKAZU, ISOBE OSAMU
• Format: Patent
• Language: Chinese; English
• Published: 02.09.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

Provided is an electromagnetic wave shielding film which has excellent transparency and a low connection resistance value even when a large number of conductive particles are mixed in a conductive adhesive layer. In this electromagnetic wave shielding film, a first insulating layer, a silver nanowire layer, a second insulating layer, and a conductive adhesive layer are laminated in this order, the thickness of the second insulating layer is 50-500 nm, the conductive adhesive layer contains a binder component and spherical or dendritic conductive particles, and the amount of the conductive particles is less than or equal to 100% by mass per 100% by mass of the conductive adhesive layer. The content ratio of the conductive particles is 1-80% by mass. 本发明提供一种即使在导电性胶粘剂层大量配混导电性粒子，也能使得透明性优越且连接电阻值低的电磁波屏蔽膜。本发明的电磁波屏蔽膜中，第1绝缘层、银纳米线层、第2绝缘层、以及导电性胶粘剂层按该顺序层叠，所述第2绝缘层的厚度为50～500nm，所述导电性胶粘剂层包括粘结剂成分和球状或树枝状的导电性粒子，相对于所述导电性胶粘剂层100质量％，所述导电性粒子的含有比例为1～80质量％。