Golden finger lead design method, golden finger lead structure and circuit board

• Main Authors: ZHANG CHUANCHAO, XIE LUNKUI, ZENG XIANGWEI, LIU CAIYOU, HUANG JUN, WU MAOLIN
• Format: Patent
• Language: Chinese; English
• Published: 02.09.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to the technical field of circuit boards, and provides a golden finger lead design method, a golden finger lead structure and a circuit board. The golden finger lead design method comprises the following steps: calculating the area of each golden finger needing to be electroplated; according to the area, needing to be electroplated, of each golden finger, the current distribution proportion needed by current reaching the end of each golden finger in the electroplating process is calculated; according to the current distribution proportion, obtaining a resistance value of an auxiliary lead corresponding to each golden finger; and according to the resistance value of the auxiliary lead corresponding to each golden finger, determining the cross sectional area and the length of the auxiliary lead corresponding to each golden finger. According to the gold finger lead design method provided by the embodiment of the invention, the thickness of a gold finger coating can be more uniform. 本申请涉及电路板