Laser chip inversion system and method

The invention relates to the technical field of chip packaging, in particular to a laser chip inversion system and method. The system provides a substrate chip, a chip driving device, a laser power supply and a photoelectric detector, wherein the chip driving device is used for driving the laser chi...

Full description

Saved in:
Bibliographic Details
Main Authors FENG DAZENG, LIANG HONG, WU AIMIN, WANG YIQIONG
Format Patent
LanguageChinese
English
Published 02.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first