Laser chip inversion system and method

• Main Authors: FENG DAZENG, LIANG HONG, WU AIMIN, WANG YIQIONG
• Format: Patent
• Language: Chinese; English
• Published: 02.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY

The invention relates to the technical field of chip packaging, in particular to a laser chip inversion system and method. The system provides a substrate chip, a chip driving device, a laser power supply and a photoelectric detector, wherein the chip driving device is used for driving the laser chip to move among a plurality of preset alignment positions of the laser chip and the substrate chip; the laser power supply is used for providing a power supply for generating and outputting laser for the laser chip; the photoelectric detector is used for detecting the related light intensity of the silicon-based waveguide. The maximum correlation light intensity in the correlation light intensities corresponding to the plurality of alignment positions is determined, and the bonding target alignment position between the laser chip and the substrate chip is determined based on the maximum correlation light intensity, so that the requirement on the alignment precision of an alignment machine is reduced, and the cost i