Semiconductor metrology method and semiconductor metrology system
The invention relates to a semiconductor metrology method and a semiconductor metrology system. A semiconductor metrology system includes a spectrum acquisition tool for collecting a baseline scattering metric spectrum on a first semiconductor wafer target and various sources for spectral variabilit...
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Main Authors | , , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
02.09.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a semiconductor metrology method and a semiconductor metrology system. A semiconductor metrology system includes a spectrum acquisition tool for collecting a baseline scattering metric spectrum on a first semiconductor wafer target and various sources for spectral variability using a first metrology protocol, collecting a variability set of scattering metric spectrums on a second semiconductor wafer target, the variability set embodying the spectral variability; the reference measurement tool is used for collecting parameter values of the first semiconductor wafer target by using a second measurement protocol; and a training unit for training, using machine learning, a predictive model for predicting a value for the production semiconductor wafer target based on a spectrum of the production semiconductor wafer target using the aforementioned collected spectrum and value, and minimizing an associated loss function incorporating a spectral variability term.
本申请涉及半导体度量方法和半导体度量系统。半导体度量系统包 |
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Bibliography: | Application Number: CN202210283417 |