Heat dissipation protection structure and electronic device package

The embodiment of the invention discloses a heat dissipation protection structure and an electronic device package, relates to the technical field of electronic equipment, and solves the problem that heat conduction liquid metal overflows during heat dissipation of an electronic component. The heat...

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Bibliographic Details
Main Author CHU ZHONGLIANG
Format Patent
LanguageChinese
English
Published 30.08.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The embodiment of the invention discloses a heat dissipation protection structure and an electronic device package, relates to the technical field of electronic equipment, and solves the problem that heat conduction liquid metal overflows during heat dissipation of an electronic component. The heat dissipation protection structure is arranged on a substrate with a first element and a second element and comprises a protection plate, a containing hole and an avoiding concave part are formed in the protection plate, the containing hole corresponds to the first element, and the containing hole is at least used for containing heat conduction liquid metal; the avoiding concave part is arranged on the side, facing the substrate, of the protection plate, the avoiding concave part is used for avoiding a second element on the substrate, and the protection plate is used for isolating the heat conduction liquid metal from the second element. The heat dissipation protection structure is used for heat dissipation protectio
Bibliography:Application Number: CN202210557142