Method for measuring Young modulus and bending rigidity of two-dimensional nano material

The invention discloses a method for measuring Young modulus and bending rigidity of a two-dimensional nano material, which comprises the following steps: forming a micron rectangular micropore array on a substrate, transferring the two-dimensional material to the micropore array, covering the recta...

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Bibliographic Details
Main Authors DONG WENLONG, LIU LUQI, CUI XUWEI, ZHANG ZHONG
Format Patent
LanguageChinese
English
Published 30.08.2022
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Summary:The invention discloses a method for measuring Young modulus and bending rigidity of a two-dimensional nano material, which comprises the following steps: forming a micron rectangular micropore array on a substrate, transferring the two-dimensional material to the micropore array, covering the rectangular micropores with the two-dimensional material to form a suspension system film, and carrying out a bubbling experiment to obtain the Young modulus and bending rigidity of the two-dimensional nano material. Uniformly-distributed loads perpendicular to the thin film are applied to the thin film on the suspended rectangular micropores so as to achieve uniaxial stretching in the short-axis direction; analyzing the morphology of the two-dimensional material, obtaining the internal and external pressure difference, carrying out stress analysis, solving the thin-layer material by adopting a thin film theory, and obtaining the Young modulus of the material in combination with the Poisson's ratio; and solving the thic
Bibliography:Application Number: CN202210555576