Method for measuring Young modulus and bending rigidity of two-dimensional nano material
The invention discloses a method for measuring Young modulus and bending rigidity of a two-dimensional nano material, which comprises the following steps: forming a micron rectangular micropore array on a substrate, transferring the two-dimensional material to the micropore array, covering the recta...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
30.08.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention discloses a method for measuring Young modulus and bending rigidity of a two-dimensional nano material, which comprises the following steps: forming a micron rectangular micropore array on a substrate, transferring the two-dimensional material to the micropore array, covering the rectangular micropores with the two-dimensional material to form a suspension system film, and carrying out a bubbling experiment to obtain the Young modulus and bending rigidity of the two-dimensional nano material. Uniformly-distributed loads perpendicular to the thin film are applied to the thin film on the suspended rectangular micropores so as to achieve uniaxial stretching in the short-axis direction; analyzing the morphology of the two-dimensional material, obtaining the internal and external pressure difference, carrying out stress analysis, solving the thin-layer material by adopting a thin film theory, and obtaining the Young modulus of the material in combination with the Poisson's ratio; and solving the thic |
---|---|
Bibliography: | Application Number: CN202210555576 |