Power connection device, electroplating clamp and electroplating equipment

• Main Authors: GONG QING, FENG SUGANG, CAO KAI, XU YINGJIE, LEI GUANGCAI, PEI WENLONG, LU JIAN
• Format: Patent
• Language: Chinese; English
• Published: 30.08.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention provides a power connection device, an electroplating clamp and electroplating equipment, and relates to the technical field of electroplating equipment. A power connection device is used for an electroplating clamp of electroplating equipment and comprises a conductive support, a plurality of conductive modules and a conductive sliding block. The conductive module comprises a first conductive clamping block and a second conductive clamping block; the first conductive clamping block and the second conductive clamping block are rotatably connected to the conductive bracket; the first conductive clamping block is provided with a first contact surface, the second conductive clamping block is provided with a second contact surface, the first contact surface and the second contact surface are oppositely arranged, an accommodating space is formed between the first contact surface and the second contact surface, and the accommodating spaces of the plurality of conductive modules are sequentially arrang