Printed circuit board and surface activation equipment for copper circuit of printed circuit board

• Main Author: LONG GUIJUN
• Format: Patent
• Language: Chinese; English
• Published: 30.08.2022
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the field of circuit board copper circuit surface activation equipment, in particular to a printed circuit board and printed circuit board copper circuit surface activation equipment, which comprises a first shell and a cover body, the first shell is hermetically connected with the cover body, and a conductive part is connected to the outer surface of the upper end of the cover body close to the middle position in a penetrating manner. A first auxiliary mechanism is arranged at the position, close to the lower end of the electroplated part, in the first shell. By arranging the first auxiliary mechanism, when a printed circuit board in the prior art is subjected to activating treatment, such as electroplating, compared with the mode that a to-be-tinned circuit board is placed in a plating tank, then the circuit board is powered on, and an electroplated part is electroplated in the prior art, the tinning efficiency is improved; the problems that the electroplating speed of electroplated