Method and device for preparing local silver plating layer through laser-assisted electrochemical deposition technology

• Main Authors: TANG YANGFAN, LENG ZHIHAO, ZHANG JIABEI, SHEN WENRONG, ZHU HAO, ZHANG CHAOYANG, LIU YANG, GUO SHENG, XU KUN
• Format: Patent
• Language: Chinese; English
• Published: 23.08.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses a method and device for preparing a local silver plating layer through a laser-assisted electrochemical deposition technology, and belongs to the field of laser composite electrochemical preparation. Laser irradiates the interface of the substrate and the solution, so that the potential of an irradiation area is improved, the irradiation area is promoted to generate electrochemical reaction, and a non-irradiation area is promoted to generate chemical replacement reaction. As the potential is increased, the deposition rate of the irradiation area is far higher than that of the non-irradiation area, and the coating thickness of the irradiation area is larger than that of the non-irradiation area; and through the deplating technology, the non-irradiated area is preferentially removed due to the fact that the plating layer is thin and the binding force with the substrate is poor, the irradiated area is reserved due to the fact that the plating layer is thick and the binding force is good,