Silicon wafer processing device for semiconductor packaging processing

• Main Authors: GU KAIFENG, CHEN HAO, DU CHAOHUI, ZHANG YUFENG, ZHANG FENG, SHOU ZHEQIONG, ZHOU JIANJUN
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention belongs to the technical field of semiconductors, and particularly relates to a silicon wafer processing device for semiconductor packaging processing, which comprises a shell, supporting blocks are mounted in the shell in a surrounding manner, a connecting block is arranged in the middle of the shell, and a top block is mounted on the shell between the supporting blocks and the adjacent supporting blocks. Magnetic stop blocks are arranged on the left side and the right side in the supporting block, an inner box is slidably installed in the lower half portion of the shell, a connecting plate is fixedly arranged at the front end of the inner box, a traction steel rope is bolted in the connecting plate, the tail end of the traction steel rope is connected with a bearing ring, and a fixing plate is fixedly arranged on the left side of the shell; the bearing ring and the fixing plate are connected in a sliding mode. According to the device, in the wafer bearing process, the bearing component can be