Bipolar plate bonding tool

• Main Authors: WANG QINPU, GONG JIANPO, SUN YANTAO, DONG NANNAN, JI AIQING, CHEN WENGUO
• Format: Patent
• Language: Chinese; English
• Published: 12.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

The invention belongs to the technical field of fuel cells, and discloses a bipolar plate bonding tool, the bipolar plate bonding tool comprises a pressing assembly and an elastic buffer temperature adjustment structure, the pressing assembly comprises a bottom plate, a cover plate and a pressing piece covering the cover plate, and an accommodating space is formed between the bottom plate and the cover plate; the bipolar plate and the elastic buffer temperature adjusting structure are stacked and are accommodated in the accommodating space, and the elastic buffer temperature adjusting structure can adjust the temperature of the bipolar plate. According to the bipolar plate bonding tool, the phenomenon that the negative plate and/or the positive plate is cracked, damaged and even fractured due to the fact that the pressure is too large in the process of pressing the bipolar plate through the pressing assembly is effectively avoided; the phenomenon that local bonding of the bipolar plate is not in place or even