Packaging structure and manufacturing method thereof

• Main Authors: LIN PURU, GUO JIHAI, ZENG ZIZHANG, KE ZHENGDA, YANG KAIMING
• Format: Patent
• Language: Chinese; English
• Published: 05.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a packaging structure and a manufacturing method thereof. The manufacturing method of the packaging structure comprises the following steps. A carrier having a surface is provided. Pressing a copper foil layer on the surface of the carrier plate; performing a subtractive process on the copper foil layer to form a copper foil circuit layer on the carrier plate; the copper foil circuit layer exposes a part of the surface of the carrier plate. Forming a layer-adding structure layer on the surfaces of the copper foil circuit layer and the carrier plate; the first surface of the copper foil circuit layer is flush with the second surface of the layer-adding structure layer. At least one electronic device is disposed on the build-up structure layer. An encapsulant is formed to cover the electronic component and the build-up structure layer. Removing the carrier plate to expose the first surface of the copper foil circuit layer; the packaging structure and the manufacturing method thereof have