Method for automatically and massively measuring hole depths of small deep holes based on deep hole measuring device

• Main Authors: CHANG CHIA-LUNG, HU HAI
• Format: Patent
• Language: Chinese; English
• Published: 05.08.2022
• Subjects: MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TESTING

The invention discloses a method for automatically and massively measuring the depth of small deep holes based on a deep hole measuring device. The deep hole measuring device comprises a camera, a measuring probe and a moving part with a built-in force sensor, the specification of the measuring probe is matched with the specification of a measuring hole in a deep hole workpiece to be measured, and the method for automatically and massively measuring the depth of the small deep holes comprises the steps that the position deviation of the camera and the measuring probe on the xy axis is measured; through coordinate conversion and in combination with hole arrangement information of the deep hole workpiece to be measured, xy-axis and y-axis position parameters of the moving part when the measuring probe is aligned with the center position of each measuring hole in the deep hole workpiece to be measured are obtained; and controlling the moving part to move to the xy-axis position parameter along the xy-axis, then