Wafer drying method and cleaning process

• Main Authors: RUAN HONGTAO, ZHOU SONG, ZHANG RAN, ZHANG YUANZHANG, PENG XIAOHUI, ZHANG LEI, LI JINPENG, TAO JIAWANG, YUE GUANGCHUN, LI CAIFENG, LIU XIAORONG, ZHANG JUANHUI
• Format: Patent
• Language: Chinese; English
• Published: 05.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CLEANING; CLEANING IN GENERAL; DRYING; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING; WEAPONS

The invention discloses a wafer drying method and a wafer cleaning process. The drying method comprises the steps that water is injected into a groove body at the bottom of a drying cavity, and a wafer supporting device supporting a wafer is completely immersed into the water; overflow water injection is conducted on the tank body, carrier gas is introduced into the top of the drying cavity to conduct pre-cleaning, and the water injection mode comprises side spraying type water injection from the side portion of the tank body, first flow water injection from the bottom of the tank body and second flow water injection; water is injected into the tank body from the bottom of the tank body at a third flow rate, and carrier gas carrying a drying agent is introduced into the top of the drying cavity for pre-drying; continuously introducing a carrier gas carrying a drying agent into the top of the drying cavity, and controlling the wafer supporting device to rise in stages for drying; and the drying cavity is purge