Photosensitive component, camera module and manufacturing method thereof
The invention provides a photosensitive component, which comprises at least one photosensitive element and a substrate, the light sensing element is arranged on the substrate, the substrate is arranged on the light sensing element, the window body circuit board comprises a circuit board main body, t...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
02.08.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a photosensitive component, which comprises at least one photosensitive element and a substrate, the light sensing element is arranged on the substrate, the substrate is arranged on the light sensing element, the window body circuit board comprises a circuit board main body, the circuit board main body is provided with at least one window, the light sensing element is arranged in the window, and the substrate is arranged below the light sensing element.
本发明提供一种感光组件,其包括至少一感光元件、一衬底;和至少一窗体线路板,其中所述窗体线路板包括一线路板主体,且所述线路板主体具有至少一窗口,所述感光元件被设置于所述窗口内,其中所述衬底被设置于所述感光元件下方。 |
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Bibliography: | Application Number: CN202210308539 |