Fingerprint sensor and manufacturing method thereof

• Main Authors: JIN JINSEN, PARK DONG-KOO, HONG SE-HWANG, PARK JAE-SUNG, CHUNG JI YOUNG
• Format: Patent
• Language: Chinese; English
• Published: 02.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PHYSICS; SEMICONDUCTOR DEVICES

The invention provides a fingerprint sensor and a manufacturing method thereof. As a non-limiting example, various aspects of the present disclosure provide various fingerprint sensor devices including an interconnect structure, such as a bond wire, at least a portion of the interconnect structure extending into a dielectric layer for seating a plate, and/or the fingerprint sensor device including an interconnect structure, such as a bond wire, at least a portion of the interconnect structure extending into the dielectric layer for seating the plate. The interconnect structure extends upwardly from the semiconductor die at a location laterally offset from the plate. 指纹感测器以及其制造方法。作为非限制性实例，本发明的各种方面提供各种指纹感测器装置以及其制造方法，所述指纹感测器装置包括互连结构，例如接合线，所述互连结构的至少一部分延伸到用来安放板的介电层中，和/或所述指纹感测器装置包括互连结构，所述互连结构从自所述板侧向地偏移的位置处的半导体裸片向上延伸。