Heating wallboard temperature control system

The invention relates to a heating wallboard temperature control system which comprises a heating wallboard assembly and a power supply assembly, the heating wallboard assembly comprises a heating film array and wallboard surface layers arranged on the two sides of the heating film array respectivel...

Full description

Saved in:
Bibliographic Details
Main Authors ZHANG RENYIN, WANG XIN
Format Patent
LanguageChinese
English
Published 02.08.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The invention relates to a heating wallboard temperature control system which comprises a heating wallboard assembly and a power supply assembly, the heating wallboard assembly comprises a heating film array and wallboard surface layers arranged on the two sides of the heating film array respectively, and the heating film array is formed by arranging a plurality of heating film units according to a set rule; each heating film unit comprises an electrode plate, a semiconductor heating layer and a packaging layer, the power supply assembly comprises a power supply and a controller which are connected with each other, the power supply is respectively connected with the electrode plates of the heating film units, and the controller controls the power supply to supply power to the heating film units at different average powers. Compared with the prior art, the heating device has the advantages of being high in heating efficiency and the like. 本发明涉及一种发热墙板温度控制系统,包括发热墙板组件和电源组件,所述的发热墙板组件包括发热膜阵列以及分别设置于发热膜阵列两侧的墙板面层,所述的发
Bibliography:Application Number: CN202210472171