Semiconductor device and manufacturing method thereof

• Main Authors: WALCZYK ARTUR, DOBNER ANDREAS, HOERSHOLDER, BJU RN, RUSS SEBASTIAN, LOOS HOLGER
• Format: Patent
• Language: Chinese; English
• Published: 29.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Described is a semiconductor device (100) comprising: a carrier (1); at least one semiconductor chip (2) which is arranged on the carrier (1) and which has at least one first electrical contact (11) on a main surface of the semiconductor chip (2) facing away from the carrier (1). The semiconductor component comprises an electrically insulating layer (3) arranged on the carrier (1) and at least one electrical connection layer (4), which is guided through the electrically insulating layer (3) to the first electrical contact (11), the electrically insulating layer (3) having a photostructurable material. The invention further relates to a method for producing a semiconductor component (100). 描述了一种半导体器件（100），包括：载体（1）；至少一个半导体芯片（2），所述至少一个半导体芯片布置在所述载体（1）上并且在所述半导体芯片（2）的背离所述载体（1）的主表面上具有至少一个第一电接触部（11）。所述半导体器件包括布置在所述载体（1）上的电绝缘层（3）以及至少一个电连接层（4），所述至少一个电连接层通过所述电绝缘层（3）引导至所述第一电接触部（11），其中所述电绝缘层（3）具有可光结构化材料。此外说明了一种用于制造半导体器件（100）的方法。