SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: QUINONES MARIA CLEMENS YPIL, DOSDOS, BIRGIRDIS, TEYSSEYRE JEROME, MANATAD ROHAN N, ALMAGRO, ERWIN, IAN, VALMENTA
• Format: Patent
• Language: Chinese; English
• Published: 29.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a semiconductor device package and a method of manufacturing a semiconductor device package. The semiconductor device package may include a lead frame having a first portion having a first extension portion and a second portion having a second extension portion. A molding material may encapsulate a portion of the lead frame and a portion of the semiconductor die mounted to the lead frame. A first set of contacts of the semiconductor die may be connected to a first surface of the first extension and a second set of contacts may be connected to a first surface of the second extension. A mold locking cavity having a molding material may be disposed to contact a second surface of the first extension portion opposite the first surface of the first extension portion, a second surface of the second extension portion opposite the first surface of the second extension portion, a first portion of the leadframe, and a second portion of the leadframe. 本申请涉及半导体器件封装和制造半导体器件封装的方法。半导体器件封装可以包括具有第一部分和第