MULTILAYER ELECTRONIC COMPONENT
The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a plurality of dielectric layers; the side edge part is arranged on the main body; and an external electrode disposed on the main body. The reliability of the multilayer...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
29.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a plurality of dielectric layers; the side edge part is arranged on the main body; and an external electrode disposed on the main body. The reliability of the multilayer electronic component is improved by controlling the content of Si at each position of the dielectric layer and the side edge portion.
本公开提供了一种多层电子组件。所述多层电子组件包括:主体,包括多个介电层;侧边缘部,设置在所述主体上;以及外电极,设置在所述主体上。通过控制所述介电层和所述侧边缘部的每个位置的Si的含量来改善所述多层电子组件的可靠性。 |
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Bibliography: | Application Number: CN202111503368 |