Comprehensive treatment method for large-size silicon wafer cutting high-concentration wastewater and low-concentration wastewater

• Main Authors: DONG KAI, LIU CHUANJUN, FENG YAN, WANG YICHENG
• Format: Patent
• Language: Chinese; English
• Published: 29.07.2022
• Subjects: CHEMISTRY; METALLURGY; TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

The invention discloses a comprehensive treatment method for large-size silicon wafer cutting high-concentration wastewater and low-concentration wastewater, which comprises a high-concentration wastewater treatment system and a low-concentration wastewater treatment system which are matched with each other, and the high-concentration wastewater treatment sequentially comprises high-concentration wastewater adjustment, plate-and-frame pressure filtration, high-concentration filtrate adjustment and high-concentration iron-carbon micro-electrolysis. After low-concentration wastewater is pretreated, the low-concentration wastewater and high-concentration wastewater subjected to iron-carbon micro-electrolysis are fed into a hydrolysis acidification pool together, then are sequentially subjected to contact oxidation and sedimentation, deep treatment and air flotation treatment, are finally lifted to an activated carbon filter through a filter feeding pump for further treatment, and are discharged after reaching th