Receptacle with connectable spring fingers for multi-point contact conduction cooling

Example embodiments relate to an electronic system that provides thermal management of a removable device when the removable device is connected to a master device of the electronic system that may include a receptacle and a heat transfer device having a first portion and a second portion. The main...

Full description

Saved in:
Bibliographic Details
Main Authors FERRER EDUARDO, LUNSMAN HARVEY J, FRANZ JOHN
Format Patent
LanguageChinese
English
Published 22.07.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:Example embodiments relate to an electronic system that provides thermal management of a removable device when the removable device is connected to a master device of the electronic system that may include a receptacle and a heat transfer device having a first portion and a second portion. The main device has a cooling member. A removable device having a heat sink is removably coupled to the main device. A receptacle having a spring finger is coupled to one of the cooling component or the heat sink. The first portion is coupled to one of the cooling component or the heat sink, and the second portion protrudes outwardly. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring finger establishes a direct thermal interface with the second portion to allow waste heat to be transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle. 示例实施方式涉及一种电子系统，该电子系统在可移除装置连接到电子系统的主装置时提供对可移除装置的热管理，该电子系
Bibliography:Application Number: CN202111246449