Packaging structure of brain wave chip processing system and manufacturing method thereof

• Main Authors: CHENG HAIYANG, ZHANG HENGYUN, LIN HAIBIN, XU QINGQUAN, LIN TINGYU
• Format: Patent
• Language: Chinese; English
• Published: 15.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of integrated circuit packaging, and particularly discloses a packaging structure of a brain wave chip processing system, which comprises a wiring layer packaging body, a chip structure layer and a first molding structure, and is characterized in that the chip structure layer is arranged on the wiring layer packaging body and is connected with the wiring layer packaging body through a first metal structure; the first molding structure is arranged on the wiring layer packaging body and wraps the chip structure layer, and the chip structure layer comprises an electroencephalogram signal processing module; the wiring layer packaging body comprises a second molding structure and at least two rewiring layers, and the part between every two adjacent rewiring layers and the periphery of each rewiring layer are wrapped by the second molding structure; and a third metal structure is arranged on the surface, deviating from the chip structure layer, of the wiring layer packag