Processing condition determination method, substrate processing method, substrate product manufacturing method, computer program, storage medium, processing condition determination apparatus, and substrate processing apparatus

• Main Authors: SHIMANO TATSUYA, INAGI DAI, OTA TAKASHI
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In the processing condition determination method, processing program information that can be used when a substrate W is processed while a discharge position of a processing liquid is moved is determined from a plurality of pieces of processing program information. The processing condition determination method includes a step (S31), a step (S32), and a step (S33). In step S31, predicted thickness information including a predicted value for the thickness of the substrate W after processing is calculated for each of the plurality of processing program information items on the basis of measured thickness information including a measured value for the thickness of the substrate W. In step S32, a plurality of pieces of predicted thickness information calculated for each of the plurality of pieces of processing program information are evaluated in accordance with a prescribed evaluation method, and predicted thickness information is selected from among the plurality of pieces of predicted thickness information. In s