Crimping type semiconductor module with short circuit failure mode

• Main Authors: LIU KEMING, LIU DONGMING, TONG YAN, FANG SHANGHUA, YAN BAIQIANG
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a crimping type semiconductor module with a short-circuit failure mode. The crimping type semiconductor module comprises a top plate, an elastic conductive assembly, a circuit board, a metal sheet, a power chip and a bottom plate which are arranged in sequence, the top plate, the elastic conductive assembly, the circuit board, the metal sheet, the power chip and the bottom plate are tightly and electrically connected through external applied pressure. And the grid electrodes of the plurality of power chips are led out through one or more than two conductors and are led out to an external terminal. The invention has the advantages that the plurality of chips are connected in parallel, when one chip fails, the chip enters a short-circuit mode, a large amount of heat is released instantaneously, and due to the arrangement of the circuit board, all the chips are electrically connected together, and the heat can be respectively diffused transversely and longitudinally. The overheating fusin