Gold plating rectifier distribution structure for improving electroplating uniformity

• Main Authors: CHU JIANGZHOU, WANG CHUANLIN
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The gold plating rectifier distribution structure comprises a bottom plate, a reaction tank is fixedly installed at the top of the bottom plate, adjusting mechanisms used for changing the position of a positive plate are arranged on the front face and the back face of the reaction tank corresponding...