Gold plating rectifier distribution structure for improving electroplating uniformity

• Main Authors: CHU JIANGZHOU, WANG CHUANLIN
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2022
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The gold plating rectifier distribution structure comprises a bottom plate, a reaction tank is fixedly installed at the top of the bottom plate, adjusting mechanisms used for changing the position of a positive plate are arranged on the front face and the back face of the reaction tank correspondingly, and the two adjusting mechanisms are symmetrically arranged relative to the center of the reaction tank; a grabbing mechanism for moving a product is arranged at the top of the reaction tank; through rotation of a rotating disc, a shifting rod is matched to drive a rotating plate to swing in a reciprocating manner, a moving rod longitudinally reciprocates, and two connecting rods are matched to pull a first sliding block to slide in a sliding groove, so that an anode plate on the first sliding block reciprocates in a reaction solution, and electric field coverage can be uniformly distributed; therefore, the product has better uniformity after being plated with gold; and through reverse rotation of the servo mot