Hybrid low resistance metal wire

A standard cell for use in semiconductor device design and manufacture and a method for manufacturing a standard cell are disclosed. Aspects disclosed include a standard cell having a plurality of wide metal lines. The wide metal line is formed of copper. The standard cell also includes a plurality...

Full description

Saved in:
Bibliographic Details
Main Authors ZHU JOHN JIANHONG, BAO JUNJING, NALLAPATI GIRIDHAR
Format Patent
LanguageChinese
English
Published 08.07.2022
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A standard cell for use in semiconductor device design and manufacture and a method for manufacturing a standard cell are disclosed. Aspects disclosed include a standard cell having a plurality of wide metal lines. The wide metal line is formed of copper. The standard cell also includes a plurality of narrow metal lines. The narrow metal wire is formed of a material having a lower resistance than copper for a wire width of a magnitude of 12 nm or less. 公开了在半导体器件设计和制造中使用的标准单元和用于制造标准单元的方法。所公开的各方面包括具有多条宽金属线的标准单元。宽金属线由铜形成。标准单元也包括多条窄金属线。对于12nm或更小的量级的线宽,该窄金属线由具有比铜更低的电阻的材料形成。
AbstractList A standard cell for use in semiconductor device design and manufacture and a method for manufacturing a standard cell are disclosed. Aspects disclosed include a standard cell having a plurality of wide metal lines. The wide metal line is formed of copper. The standard cell also includes a plurality of narrow metal lines. The narrow metal wire is formed of a material having a lower resistance than copper for a wire width of a magnitude of 12 nm or less. 公开了在半导体器件设计和制造中使用的标准单元和用于制造标准单元的方法。所公开的各方面包括具有多条宽金属线的标准单元。宽金属线由铜形成。标准单元也包括多条窄金属线。对于12nm或更小的量级的线宽,该窄金属线由具有比铜更低的电阻的材料形成。
Author ZHU JOHN JIANHONG
NALLAPATI GIRIDHAR
BAO JUNJING
Author_xml – fullname: ZHU JOHN JIANHONG
– fullname: BAO JUNJING
– fullname: NALLAPATI GIRIDHAR
BookMark eNrjYmDJy89L5WRQ8KhMKspMUcjJL1coSi3OLC5JzEtOVchNLUnMUSjPLErlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhibmxgbmxsaOxsSoAQAqHSbu
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate 混合低电阻金属线
ExternalDocumentID CN114730733A
GroupedDBID EVB
ID FETCH-epo_espacenet_CN114730733A3
IEDL.DBID EVB
IngestDate Fri Jul 19 12:57:49 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN114730733A3
Notes Application Number: CN202080076478
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220708&DB=EPODOC&CC=CN&NR=114730733A
ParticipantIDs epo_espacenet_CN114730733A
PublicationCentury 2000
PublicationDate 20220708
PublicationDateYYYYMMDD 2022-07-08
PublicationDate_xml – month: 07
  year: 2022
  text: 20220708
  day: 08
PublicationDecade 2020
PublicationYear 2022
RelatedCompanies QUALCOMM INCORPORATED
RelatedCompanies_xml – name: QUALCOMM INCORPORATED
Score 3.5386095
Snippet A standard cell for use in semiconductor device design and manufacture and a method for manufacturing a standard cell are disclosed. Aspects disclosed include...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Hybrid low resistance metal wire
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220708&DB=EPODOC&locale=&CC=CN&NR=114730733A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQAV1bnWKWZqBrAawLdE3MLNJ0LY0Nk3RNzI3SjFKNjY1SLUAbnH39zDxCTbwiTCOYGLJge2HA54SWgw9HBOaoZGB-LwGX1wWIQSwX8NrKYv2kTKBQvr1biK2LGrR3bGQETMEWai5Otq4B_i7-zmrOzrbOfmp-QbbAZr85KDkbOzIzsAKb0eag3OAa5gTalVKAXKW4CTKwBQBNyysRYmCqyhBm4HSG3bwmzMDhC53wBjKhea9YhEHBoxK0u0ohJ79cAdhHBrX7gBIKuUB35iiAThwWZVB0cw1x9tAFWhUP91e8sx_CVcZiDCzA_n6qBINCkkEasA8COigQWL0mJ1skpoGqdRPLVEsTi0QjY3NJBinc5kjhk5Rm4AKFEXi1qYUMA0tJUWmqLLBOLUmSAwcGAASbeJc
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQAV1bnWKWZqBrAawLdE3MLNJ0LY0Nk3RNzI3SjFKNjY1SLUAbnH39zDxCTbwiTCOYGLJge2HA54SWgw9HBOaoZGB-LwGX1wWIQSwX8NrKYv2kTKBQvr1biK2LGrR3bGQETMEWai5Otq4B_i7-zmrOzrbOfmp-QbbAZr85KDkbOzIzsAKb2Bag2w5cw5xAu1IKkKsUN0EGtgCgaXklQgxMVRnCDJzOsJvXhBk4fKET3kAmNO8VizAoeFSCdlcp5OSXKwD7yKB2H1BCIRfozhwF0InDogyKbq4hzh66QKvi4f6Kd_ZDuMpYjIEF2N9PlWBQSDJIA_ZBQAcFAqvX5GSLxDRQtW5imWppYpFoZGwuySCF2xwpfJLyDJweIb4-8T6eft7SDFyg8AKvPLWQYWApKSpNlQXWryVJcuCAAQDTYnuH
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Hybrid+low+resistance+metal+wire&rft.inventor=ZHU+JOHN+JIANHONG&rft.inventor=BAO+JUNJING&rft.inventor=NALLAPATI+GIRIDHAR&rft.date=2022-07-08&rft.externalDBID=A&rft.externalDocID=CN114730733A