Apparatus for separating semiconductor chips and method for separating semiconductor chips by using same

• Main Authors: JANG YOON-SEON, KIM EUN-BEOM, KIM JUNG HAK, LEE KWANG JOO, KIM JU-HYEON
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a pushing member on a side of a base member opposite to a side on which a semiconductor chip is disposed, and moving the pushing member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip moved together with the pushing member from the base member by the pickup unit. The adhesive member and the urging member are each magnetized such that a repulsive force acts on each other. 公开了用于将经由粘合构件而设置在基底构件上的半导体芯片从基底构件分离的装置和方法。所述方法包括：在基底构件的与其上设置有半导体芯片的一侧相反的一侧上提供推动构件，并且在与半导体芯片邻近的方向上移动推动构件的步骤；以及通过拾取单元将与推动构件一起移动的半导体芯片从基底构件分离的步骤。粘合构件和推动构件各自被磁化使得排斥力作用于彼此。