Use of deformable contacts and pre-coated underfill to bond led devices via laser

• Main Authors: TORRENTS ABAD OSCAR, ZHAO ZHENGSONG, SENGUR, ALI, SAKTI, POJA, BRODOSEANU, DANIEL, WU ZHENBANG, FARRENS SHARI
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The object of the present invention is an enhanced system and method for electrically coupling, bonding and/or securing electrical contacts of a semiconductor device to electrical contacts of other semiconductor devices using a pulse-triggered photon (or EM energy) source (e.g., but not limited to a laser). All or part of the rows of LEDs are electrically coupled, bonded and/or secured to a backplane of the display device. The LED may be a [mu] LED. A pulsed photon source is used to illuminate the LED by scanning photon pulses. The EM radiation is absorbed by the surface, the body, the substrate, the electrical contact of the LED, and/or the electrical contact of the backplane to generate thermal energy that causes bonding between the electrical contact of the LED and the electrical contact of the backplane. The time-domain and spatial distribution of the photon pulses and the pulse frequency and scanning frequency of the photon source are selected to control adverse thermal effects. 本发明的目的在于用于使用脉冲触发的光子(或EM能量