Low temperature sintered coating for plasma chamber

• Main Authors: WETZEL DAVID JOSEPH, LOPEZ MICHAEL, SRINIVASAN SATISH, KERNS JOHN MICHAEL, DETERT DOUGLAS, XU LIN, DAUGHERTY JOHN, KIRSCHEY, ROBIN
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

A method for forming a coating on a component of a substrate processing system includes: arranging the component in a processing chamber; and applying a ceramic material to form the coating on one or more surfaces of the component. The ceramic material includes a mixture that includes a rare earth oxide and has a grain size of less than 150 nm and is applied at a temperature of less than 400 DEG C within the process chamber. And the thickness of the coating is less than 30 microns. A heat treatment process is performed on the coated component in a heat treatment chamber. The heat treatment process includes raising a temperature of the heat treatment chamber from a first temperature to a second temperature for a first period of time, and maintaining the second temperature for a second period of time, where the second temperature does not exceed a melting temperature of the mixture. 一种用于在衬底处理系统的部件上形成涂层的方法包括：将所述部件布置在处理室中；以及施加陶瓷材料以在所述部件的一个或更多个表面上形成所述涂层。所述陶瓷材料包括混合物，所述混合物包括稀土氧化物且晶粒尺寸小于150nm，并且是在所述处理室内的温度小于400℃时施加。所