COOLING MODULE FOR AN ELECTRICAL ASSEMBLY
The invention relates to a cooling unit (101a, 101b) for dissipating heat generated by an electronic component (40) of an electrical assembly (1), the cooling unit (101a, 101b) comprising a first portion (20) and a second portion (30), each of the first and second portions having a substantially par...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
08.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a cooling unit (101a, 101b) for dissipating heat generated by an electronic component (40) of an electrical assembly (1), the cooling unit (101a, 101b) comprising a first portion (20) and a second portion (30), each of the first and second portions having a substantially parallelepiped shape and forming a hollow portion. The first portion (20) and the second portion (30) meet at a joining region (51) of the cooling unit (101a, 101b), the first portion (20) and the second portion (30) each comprising a first outer surface (22, 32) facing the other portion (32, 22), and the first outer surfaces (22, 32) each comprising a receiving region for receiving one or more of the electronic components (40); at least one of the portions (20, 30) comprises a connection opening (25 or 35) configured to be connected to another portion of the cooling module (10) separate from the cooling unit; the cooling unit (101a, 101b) further comprises at least one hole (55) formed in one of the portions (20, 30) |
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Bibliography: | Application Number: CN202111559707 |