Gasket assembly and coil module

• Main Authors: WANG WENTAO, CHEN QIANG, XU ZHIHENG, XIE HONGQIONG, SHEN JUN, TANG JIAWEI
• Format: Patent
• Language: Chinese; English
• Published: 08.07.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRICITY; INDUCTANCES; MAGNETS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS; USE OF MATERIALS AS ADHESIVES

The invention discloses a gasket assembly and a coil module, and belongs to the technical field of electronic device assembly. The gasket assembly comprises a release film layer and a plurality of adhesive layers, the release film layer comprises a base body and a plurality of separation parts, and a handle is arranged on one side of the base body; the multiple separation parts are arranged on the periphery of the base body, the multiple separation parts of the first part are arranged on the two sides of the handle, one end of each separation part of the second part is connected to the base body through a connecting part, each separation part of the second part and the base body are spaced to form a separation groove, and each connecting part is located on the side, away from the handle, of the corresponding separation groove; the plurality of separation parts are in one-to-one correspondence with the plurality of adhesive layers, and each separation part is bonded with the adhesive layer. According to the ga