Chip card, semiconductor chip for use in chip card

• Main Authors: M. HUBER, D. HOUDEAU, P. STAMPKA
• Format: Patent
• Language: Chinese; English
• Published: 21.04.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING RECORD CARRIERS; PHYSICS; PRESENTATION OF DATA; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES

发明涉及一种具有一个卡体(1)和多个由导电材料构成的接触面(3)的芯片卡，其中，接触面(3)与接头(11)电气连接，接头(11)配属于一个在半导体芯片(4)的半导体衬底(10)上形成的电子电路。接触面(3)是以一个建有结构的敷层的形式在半导体芯片(4)的面向电子电路的主表面上形成的，其中，与接触面(3)一并形成的半导体芯片(4)如此地插入和固定在芯片卡的卡体(1)的容纳口(2)中，使接触面(3)与卡体(1)的外表面(7)基本齐平地伸展。为了保证具有足够高的机械柔性，硅衬底的厚度最好小于100μm。 The smart card has a card body and a plurality of contact areas exposed on a flat surface of the card body. The contact areas are fabricated from electrically conductive material and are electrically connected to contact terminals, which are assigned to an electronic circuit formed on the semiconductor substrate of a semiconductor chip. The contact areas are fabricated as a structured coating on a main surface of the semiconductor chip. The semiconductor chip, after fabrication with the contact areas is inserted and fixed in a receptacle opening in the card body of the smart card in such a way that the contact areas extend essentially flush with the outer face of the card body. In order to ensure sufficiently high mechanical flexibility, the thickness of the silicon substrate of the chip is preferably less than about 100 mum.