Negative photosensitive resin composition and pattern forming method

• Main Authors: KONDO TAKAHIRO, MASUJIMA MASAHIRO, TAKEUCHI HIROAKI, YAMAGATA KENICHI
• Format: Patent
• Language: Chinese; English
• Published: 28.06.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The invention provides a negative-type photosensitive resin composition and a pattern forming method which are difficult to generate undercutting in pattern forming. The negative photosensitive resin composition contains an epoxy group-containing compound, a photo-cationic polymerization initiator, and a resin having a structural unit represented by general formula (ahs1). The epoxy group-containing compound contains a novolac epoxy resin. The photo-cationic polymerization initiator contains an onium borate. In the general formula (ahs1), R is a hydrogen atom, an alkyl group having 1-5 carbon atoms, or a halogenated alkyl group having 1-5 carbon atoms. YaX1 represents a single bond or a divalent linking group. And Wax1 represents an optionally substituted aromatic hydrocarbon group. And nax1 is an integer of 1 or more. [Chemical Formula 1] 本发明提供一种在图案形成中难以产生底切的负型感光性树脂组合物以及图案形成方法。采用含有含环氧基化合物、光阳离子聚合引发剂、具有以通式(ahs1)表示的结构单元的树脂的负型感光性树脂组合物。含环氧基化合物包含酚醛清漆型环氧树脂。光阳离子聚合引发剂包含鎓硼酸盐。通式(ahs1)中，R为氢原子、碳原子数为1～5的烷基或者碳原子数为1～5的卤代烷基。