Evaporation source device and use method thereof

• Main Authors: WANG WEIWEI, ZHOU WENBIN, CHENG BAOLONG, LI GAOMIN, FENG FENG, SUN JIAN, GAO YUDI
• Format: Patent
• Language: Chinese; English
• Published: 28.06.2022
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to the technical field of evaporation, and particularly discloses an evaporation source device and a using method thereof. The evaporation source device comprises a cavity, a first baffle, a second baffle, a rotating shaft and an evaporation source. A first evaporation hole is formed in the first baffle, a second evaporation hole is formed in the second baffle, and the first evaporation hole and the second evaporation hole can form a circulation channel; wherein the rotating shaft is connected with the first baffle and the second baffle; the two evaporation sources are arranged below the two second baffles respectively in the vertical direction, a first evaporation material is arranged in one evaporation source, and a second evaporation material is arranged in the other evaporation source. The rotating shaft can drive the first baffle and the second baffle to rotate in the axial direction of the rotating shaft, so that the circulation area of the circulation channel is adjusted, and the