High-efficiency heat-dissipation deep-etching double-channel ridge-shaped quantum cascade laser and manufacturing method thereof

The invention discloses an efficient heat dissipation deep etching double-channel ridge-shaped quantum cascade laser and a manufacturing method. The method comprises the following steps: growing a lower cladding, an active region and an upper cladding on an InP substrate; depositing a layer of hard...

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Bibliographic Details
Main Authors QIAO ZHONGLIANG, LIU GUOJUN, LI ZAIJIN, CHEN HAO, QU YI, MA XUEHUAN, LI LIN, ZHAO ZHIBIN
Format Patent
LanguageChinese
English
Published 24.06.2022
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Summary:The invention discloses an efficient heat dissipation deep etching double-channel ridge-shaped quantum cascade laser and a manufacturing method. The method comprises the following steps: growing a lower cladding, an active region and an upper cladding on an InP substrate; depositing a layer of hard mask, defining a laser waveguide image through thin photoresist and UV photoetching, and transferring the waveguide image to the SiO2 hard mask layer through reactive ion etching; removing the photoresist and sequentially etching the upper cladding layer, the active region and the lower cladding layer; ohmic contact is deposited on the upper cladding to serve as a laser top contact electrode, and ohmic contact is deposited at the bottom of the substrate to serve as a laser bottom contact electrode. The laser comprises an InP substrate, a lower cladding, an active region and an upper cladding, the upper cladding layer, the active region and the lower cladding layer are etched into the same shape as a laser waveguide
Bibliography:Application Number: CN202210293011