SUBSTRATE PROCESSING SYSTEM AND PARTICLE REMOVAL METHOD

• Main Authors: MORIOKA TATSUYA, HARA DAISUKE, OSADA HIDEYUKI, NANASAKI GENICHI, NIHEI HIKARU, MATSUI, TOMOHIRO
• Format: Patent
• Language: Chinese; English
• Published: 24.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a substrate processing system and a fine particle removal method. A cause factor of fine particles is removed from a storage chamber without providing a cooling mechanism in the storage chamber to be removed of the fine particles. The particle removal operation comprises: a step (a) in which at least one dummy substrate placed on at least one substrate cooling stage is cooled to a first temperature of 5 DEG C to 20 DEG C; and (b) maintaining the at least one end effector at any one of a plurality of positions in the vacuum transfer module or the substrate processing module for a first period of 30 seconds or more in a state in which the at least one cooled substrate dummy sheet is placed on the at least one end effector. 本发明提供一种基板处理系统和微粒去除方法，不在设为微粒的去除对象的收容室设置冷却机构地从收容室去除微粒的原因要素。微粒去除动作具有以下工序：工序(a)、将载置于至少1个基板冷却台上的至少1个基板假片冷却至第一温度，第一温度为5℃～20℃；以及工序(b)、在将冷却后的至少1个基板假片载置于至少1个末端执行器上的状态下，将至少1个末端执行器在真空搬送模块内或基板处理模块内的多个位置中的任一位置维持第一期间，第一期间为30秒以上。