Adhesive layer to enhance packaging of superconducting devices

Techniques related to packaging one or more superconducting devices of a quantum processor (100) are provided. For example, one or more embodiments described herein may contemplate a method that may include depositing an adhesion layer (402) onto a superconducting resonator (102) and a silicon subst...

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Bibliographic Details
Main Authors HAIGHT ROBERT, ADIGE VIVEKANANDA, SANDBERG MICHAEL, PAIK HANHEE, AFGALI-ARDAKANI, ALI
Format Patent
LanguageChinese
English
Published 14.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRICITY
PHYSICS
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
WAVEGUIDES
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Summary:Techniques related to packaging one or more superconducting devices of a quantum processor (100) are provided. For example, one or more embodiments described herein may contemplate a method that may include depositing an adhesion layer (402) onto a superconducting resonator (102) and a silicon substrate (104), the superconducting resonator and the silicon substrate being included within a quantum processor. A superconducting resonator may be located on a silicon substrate. In addition, the adhesive layer may contain a compound having a thiol functional group. 提供了关于封装量子处理器(100)的一个或多个超导器件的技术。例如，在此描述的一个或多个实施方案可以考虑一种方法，该方法可以包括将粘附层(402)沉积到超导谐振器(102)和硅基板(104)上，该超导谐振器和硅基板被包括在一个量子处理器内。超导谐振器可以位于硅基板上。此外，粘附层可以包含具有硫醇官能团的化合物。
Bibliography:Application Number: CN202080076791