Substrate impurity removing method and substrate processing equipment

• Main Authors: PARK JUN-WOO, SEO MOON-SUN, SHIN DONG-YOUL
• Format: Patent
• Language: Chinese; English
• Published: 14.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The present disclosure relates to a substrate impurity removal method and a substrate processing apparatus which shorten the time of removing impurities and improve the efficiency of removing impurities. The substrate impurity removal method includes: a temperature raising process of raising a temperature of a substrate disposed in a first chamber member to an impurity removal temperature; a transfer process of transferring the substrate from the first chamber member to the second chamber member; and a maintaining process of maintaining the substrate transferred into the second chamber member at the impurity removal temperature. 本公开涉及一种缩短移除杂质的时间且提高移除杂质的效率的衬底杂质移除方法及衬底处理设备。衬底杂质移除方法包括：使设置在第一腔室部件中的衬底的温度升高到杂质移除温度的温度升高过程；将衬底从第一腔室部件转移到第二腔室部件的转移过程；以及将转移到第二腔室部件中的衬底维持在杂质移除温度的维持过程。