Low-cost contact resistance testing method for chip bonding conductive adhesive

• Main Authors: WANG LU, ZOU JIAJIA, CHEN FANG, WANG DAOCHANG, HUANG MENGQIU, LI LEI
• Format: Patent
• Language: Chinese; English
• Published: 14.06.2022
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention relates to the technical field of contact resistance testing, in particular to a low-cost contact resistance testing method for a chip bonding conductive adhesive, which comprises the following steps of: firstly, manufacturing a substrate with patterns, non-plated through holes and a solder resist dam by using a traditional PCB (Printed Circuit Board) process; secondly, a chip bonding conductive adhesive is plugged into the non-metallized hole; then, the substrate is solidified; and finally, electrodes of a voltammeter are connected to different patterns of the substrate, different voltages and test currents are set, and the contact resistance of the chip bonded with the conductive adhesive is calculated. The method effectively solves the problems that a traditional contact resistance testing method is multiple in testing interference factors, inaccurate in testing result, incapable of carrying out environment test assessment and limit condition assessment, complex in sample preparation process