Surface-metallized and whole-particle composite solder ball for circuit board assembly

• Main Authors: JACOB KONSTANTIN, BUCHER SEBASTIAN
• Format: Patent
• Language: Chinese; English
• Published: 07.06.2022
• Subjects: CASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MACHINE TOOLS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SOLDERING OR UNSOLDERING; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING METALLIC POWDER

The object of the invention is a method for producing surface-metallized and whole-particle composite solder balls comprising an inner core consisting of expanded polystyrene spherical carrier particles of diameter D0 and having an intraparticle porosity of at least 50%, and an outer shell covering the carrier particles and consisting of a plurality of metal surface layers. The object of the invention is also pellets that can be obtained by the method according to the invention, and their use in the assembly of circuit boards. 本发明的目的是一种制造表面金属化并整粒的复合焊料球的方法，这些焊料球包括内芯和外壳，所述内芯由直径为D0的发泡聚苯乙烯球形载体颗粒构成，并且粒内孔隙率至少为50％，所述外壳包覆所述载体颗粒并且由多层金属表面层构成。本发明的目的还在于可以通过根据本发明方法获得的球粒，以及它们在电路板组装方面的用途。