Method for determining pattern defects based on developed images

• Main Authors: OYARZON RIVERA BENJAMIN ALEJANDRO, SLACHTER ANDREW, MASLOW MARK JOHN, MAAS RUBEN C, PISARENKO, MICHAEL, KOOYMAN MAARTEN, TEL WIM TJIBBO
• Format: Patent
• Language: Chinese; English
• Published: 27.05.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

A method of training a model configured to predict whether a feature associated with an imaging substrate will be defective after etching of the imaging substrate is described herein, and to determine an etching condition based on the trained model. The method includes acquiring, via a metrology tool, (i) a post-development image of the imaging substrate at a given location, the post-development image including a plurality of features, and (ii) a post-etch image of the imaging substrate at the given location; and training a model using the developed image and the etched image, the model configured to determine a defect of a given feature of the plurality of features in the developed image. In one embodiment, the determination of defects is based on comparing a given feature in the developed image to a corresponding etch feature in the etched image. 本文中描述了一种训练模型的方法，该模型被配置为预测与成像衬底相关联的特征在成像衬底的蚀刻之后是否将有缺陷，并且基于已训练模型确定蚀刻条件。该方法包括经由量测工具获取(i)在给定位置处的成像衬底的显影后图像，显影后图像包括多个特征，以及(ii)在给定位置处的成像衬底的蚀刻后图像；以及使用显影后图像和蚀刻后图像训练模型，该模型被