Methods of bonding substrates and separating portions of bonded substrates by bonding portions, such as making array of liquid lenses and separating array into separate liquid lenses

• Main Author: WIN THIDA MA
• Format: Patent
• Language: Chinese; English
• Published: 27.05.2022
• Subjects: CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; METALLURGY; MINERAL OR SLAG WOOL; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

A method of forming and manipulating a bond between substrates, the method comprising: emitting a first laser energy onto a strip of absorbent material between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate, resulting in a workpiece having a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to produce a fracture line through the bond, the first substrate and the second substrate, the second laser energy being provided by an approximate Bessel beam incident on the bond and having a diameter greater than the width of the bond; and repeatedly emitting a second laser energy along the length of the bond to produce a series of fracture lines through the bond, the series of fracture lines forming the contour. 一种在基材之间形成结合部并操纵该结合部的方法，所述方法包括：将第一激光能发射到位于第一基材与第二基材之间的吸收材料条带上，直到条带扩散到第一基材和第二基材中，从而得到在第一基材与第二基材之间具有结合部的工件；发射第二激光能，使其在结合部处通过工件以产生通过结合部、第一基材和第二基材的断裂线，第二激光能由近似贝塞尔光束提供，该近似贝塞尔光